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SSL152x
SMPS ICs for mains LED drivers
Rev. 01 -- 15 September 2008 Product data sheet
1. General description
The SSL152x family is a Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains. It is implemented in the high-voltage EZ-HV SOI process, combined with a low-voltage BiCMOS process. The device includes a high-voltage power switch and a circuit for start-up directly from the rectified mains voltage. A dedicated circuit for valley switching is built in, which makes a very efficient slim-line electronic concept for solid state lighting applications possible. The SSL152x can operate in applications with a power range of up to 15 W. For a power range between 15 W and 25 W the SSL1623PH is the best choice. For LED powers above 25 W the SSL1750 can be used. In its most basic version of application, the SSL152x family acts as a voltage source. Here, no additional secondary electronics are required. A combined voltage and current source can be realized with minimum costs for external components. Implementation of the SSL152x family renders an efficient and low cost power supply system for mains LED drivers.
2. Features
I Designed for mains LED drivers up to 15 W I Integrated power switch: N SSL1522: 12 ; 650 V N SSL1523: 6.5 ; 650 V I Operates from universal AC mains supplies (80 V to 276 V) I Adjustable frequency for flexible design I RC oscillator for load insensitive regulation loop constant I Valley switching for minimum switch-on loss I Frequency reduction at low power output makes low standby power possible (< 100 mW) I Adjustable overcurrent protection I Undervoltage protection I Temperature protection I Short circuit winding protection I Simple application with both primary and secondary (opto) feedback I Available in DIP8 and SO14 packages
NXP Semiconductors
SSL152x
SMPS ICs for low power systems
3. Applications
I I I I I I Retro fit LED lamps LED ballasts Contour lighting Channel letter lighting Commercial lighting, e.g. cabinet or freezer lights Other lighting applications
4. Quick reference data
Table 1. Symbol VDRAIN RDSon Quick reference data Parameter voltage on pin DRAIN drain-source on-state resistance Conditions DMOS power transistor; Tj > 0 C SSL1522; Isource = -0.25 A Tj = 25 C Tj = 100 C SSL1523; Isource = -0.50 A Tj = 25 C Tj = 100 C VCC fosc IDRAIN supply voltage oscillator frequency current on pin DRAIN VDRAIN > 60 V no auxiliary supply with auxiliary supply Tamb ambient temperature -20 1.5 30 2 125 +85 mA A C continuous -0.4 10 6.5 9.0 100 7.5 10.0 +40 200 V kHz 12 17 13.8 19.6 Min -0.4 Typ Max +650 Unit V
5. Ordering information
Table 2. Ordering information Package Name SSL1523P SSL1522T DIP8 SO14 Description plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 14-leads; body width 3.9 mm Version SOT97-1 SOT108-1 Type number
SSL152x_1
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
6. Block diagram
VCC
1 (1)
SUPPLY
8 (14)
DRAIN
VALLEY
SSL152x
7 (12, 13)
n.c.
GND
2 (2, 3, 4, 5, 9, 10)
LOGIC
100 mV
stop 3 (6)
RC
OSCILLATOR
THERMAL SHUTDOWN PROTECTION LOGIC POWER - UP RESET
6 (11)
SOURCE
low freq
F 1.8 U
blank
overcurrent 4 (7) REG short circuit winding
0.75 V 2.5 V 10x 0.5 V
5 (8)
AUX
014aaa563
Pin numbers without parenthesis refer to DIP8 packages and within parenthesis refer to SO14 packages.
Fig 1.
Block diagram
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
7. Pinning information
7.1 Pinning
VCC GND GND VCC GND RC REG 1 2 8 7 DRAIN n.c. SOURCE AUX GND GND RC REG
1 2 3 4 5 6 7
014aaa341
14 DRAIN 13 n.c. 12 n.c.
SSL152xT
11 SOURCE 10 GND 9 8 GND AUX
SSL152xP
3 4
014aaa340
6 5
Fig 2.
Pin configuration DIP8
Fig 3.
Pin configuration SO14
7.2 Pin description
Table 3. Symbol VCC GND GND GND GND RC REG AUX GND GND SOURCE n.c. n.c. DRAIN Pin description Pin DIP8 1 2 3 4 5 6 7 8 SO14 1 2 3 4 5 6 7 8 9 10 11 12 13 14 supply voltage ground ground ground ground frequency setting regulation input input for voltage from auxiliary winding for timing (demagnetization) ground ground source of internal MOS switch not connected not connected drain of internal MOS switch; input for start-up current and valley sensing Description
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
8. Functional description
The SSL152x family is the heart of a compact flyback converter, with the IC placed at the primary side. The auxiliary winding of the transformer can be used for indirect feedback to control the isolated output. This additional winding also powers the IC. A more accurate control of the output voltage and/or current can be implemented with an additional secondary sensing circuit and opto coupler feedback. The SSL152x family uses voltage mode control. The switching frequency is determined by the maximum transformer demagnetizing time and the time of the oscillator. In the first case, the converter operates in the Self Oscillating Power Supply (SOPS) mode. In the latter case, it operates at a constant frequency, which can be adjusted with external components RRC and CRC. Furthermore, a primary stroke is started only in a valley of the secondary ringing. This can use constant power or constant current mode to drive LEDs. The valley switching principle minimizes capacitive switch-on losses.
8.1 Start-up and undervoltage lockout
Initially, the IC is self-supplying from the rectified mains voltage. The IC starts switching as soon as the voltage on pin VCC passes the VCC(startup) level. The supply is taken over by the auxiliary winding of the transformer as soon as VCC is high enough and the supply from the line is stopped for high efficiency operation. When for some reason the auxiliary supply is not sufficient, the high-voltage supply also supplies the IC. As soon as the voltage on pin VCC drops below the VCC(stop) level, the IC stops switching and restarts from the rectified mains voltage.
8.2 Oscillator
The frequency of the oscillator is set by the external resistor and capacitor on pin RC. The external capacitor is charged rapidly to the VRC(max) level and, starting from a new primary stroke, it discharges to the VRC(min) level. Because the discharge is exponential, the relative sensitivity of the duty factor to the regulation voltage at low duty factor is almost equal to the sensitivity at high duty factors. This results in a more constant gain over the duty factor range compared to systems with a linear sawtooth oscillator. Stable operation at low duty factors is easily realized. For high efficiency, the frequency is reduced as soon as the duty factor drops below a certain value. This is accomplished by increasing the oscillator charge time. To ensure that the capacitor can be charged within the charge time, the value of the oscillator capacitor should be limited to approximately 1 nF.
8.3 Duty factor control
The duty factor is controlled by the internal regulation voltage and the oscillator signal on pin RC. The internal regulation voltage is equal to the external regulation voltage (minus 2.5 V) multiplied by the gain of the error amplifier (typically 20 dB).
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
8.4 Valley switching
A new cycle is started when the primary switch is switched on (see Figure 4). After a certain time (determined by the oscillator voltage RC and the internal regulation level), the switch is turned off and the secondary stroke starts. The internal regulation level is determined by the voltage on pin REG. After the secondary stroke, the drain voltage shows an oscillation with a frequency of approximately: 1 ---------------------------------------------2 x x (L p x C p) where: Lp = primary self-inductance Cp = parasitic capacitance on drain node As soon as the oscillator voltage is high again and the secondary stroke has ended, the circuit waits for a low drain voltage before starting a new primary stroke. Figure 4 shows the drain voltage together with the valley signal, the signal indicating the secondary stroke and the RC voltage. The primary stroke starts some time before the actual valley at low ringing frequencies, and some time after the actual valley at high ringing frequencies. (1)
primary stroke
secondary stroke
secondary ringing
drain
valley
secondary stroke A RC oscillator regulation level B
mgt423
A: Start of new cycle with valley switching. B: Start of new cycle in a classical system.
Fig 4.
Signals for valley switching
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
Figure 5 shows a typical curve for a reflected output voltage N x Vo of 80 V. This voltage is the output voltage Vo (see Figure 6) transferred to the primary side of the transformer with the factor N (determined by the turns ratio of the transformer). Figure 5 shows that the system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz, thus reducing the switch-on losses to a minimum. At 200 kHz, the next primary stroke is started at 33 before the valley. The switch-on losses are still reduced significantly.
40 phase () 20
mgt424
0
-20
-40
0
200
400
600 f (kHz)
800
Fig 5.
Typical phase of drain ringing at switch-on (at N x Vo = 80 V)
8.5 Demagnetization
The system operates in discontinuous conduction mode all the time. As long as the secondary stroke has not ended, the oscillator will not start a new primary stroke. During the first tsup(xfmr_ring) seconds, demagnetization recognition is suppressed. This suppression may be necessary in applications where the transformer has a large leakage inductance and at low output voltages.
8.6 Minimum and maximum duty factor
The minimum duty factor of the switched mode power supply is 0 %. The maximum duty factor is set to 75 % (typical value at 100 kHz oscillation frequency).
8.7 OverCurrent Protection (OCP)
The cycle-by-cycle peak drain current limit circuit uses the external source resistor RI to measure the current. The circuit is activated after the leading edge blanking time tleb. The protection circuit limits the source voltage to VSOURCE(max) and thus limits the primary peak current.
8.8 Short circuit winding protection
The short circuit winding protection circuit is also activated after the leading edge blanking time. If the source voltage exceeds the short circuit winding protection voltage Vswp, the IC stops switching. Only a power-on reset will restart normal operation. The short circuit winding protection also protects in case of a secondary diode short circuit.
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
8.9 OverTemperature Protection (OTP)
An accurate temperature protection is provided in the device. When the junction temperature exceeds the thermal shutdown temperature, the IC stops switching. During thermal protection, the IC current is lowered to the start-up current. The IC continues normal operation as soon as the overtemperature situation has disappeared.
8.10 OverVoltage Protection (OVP)
Overvoltage protection can be achieved in the application by pulling pin REG above its normal operation level. The current primary stroke is terminated immediately. No new primary stroke is started until the voltage on pin REG drops to its normal operation level. Pin REG has an internal clamp. The current feed into this pin must be limited.
8.11 Characteristics of complete LED power supply
8.11.1 Input
The input voltage range comprises the universal AC mains from 80 V to 276 V.
8.11.2 Accuracy
The accuracy of the complete converter, functioning as a voltage source with primary sensing, is approximately 8 % (mainly dependent on the transformer coupling). The accuracy with secondary sensing is defined by the accuracy of the external components. For safety requirements in case of opto coupler feedback loss, the primary sensing remains active when an overvoltage circuit is connected.
8.11.3 Efficiency
An efficiency over 80 % at maximum output power can be achieved for a complete converter designed for universal mains.
8.11.4 Ripple
A minimum ripple is obtained in a system designed for a maximum duty factor of 50 % under normal operating conditions and a minimized dead time. The magnitude of the ripple in the output voltage is determined by the frequency and duty factor of the converter, the output current level, and the value and ESR of the output capacitor.
8.11.5 Output
A wide range of output power levels can be handled by choosing the RDSon and package of the SSL152x family. Power levels of up to 15 W can be realized.
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
9. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground; positive currents flow into the device; pins VCC and RC are not allowed to be current driven and pins REG and AUX are not allowed to be voltage driven. Symbol Voltages VCC VRC VSOURCE VDRAIN Currents IREG IAUX Isource IDRAIN General Ptot total power dissipation DIP8 package; Tamb < 45 C SO14 package; Tamb < 50 C Tstg Tamb Tj Vesd storage temperature ambient temperature junction temperature electrostatic discharge voltage human body model machine model
[1] [2]
[1] [2]
Parameter supply voltage voltage on pin RC voltage on pin SOURCE voltage on pin DRAIN
Conditions continuous oscillator input voltage DMOS power transistor DMOS power transistor; Tj > 0 C
Min -0.4 -0.4 -0.4 -0.4
Max +40 +3 +5 +650
Unit V V V V
current on pin REG current on pin AUX source current current on pin DRAIN SSL1522 SSL1523 SSL1522 SSL1523
-10 -1 -2 -1 -2
6 +5 +1 +2 +1 +2
mA mA A A A A
-55 -20 -20 -
1.0 1.0 +150 +85 +145 2500 200
W W C C C V V
Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. All pins are 2500 V maximum, except pin DRAIN, which is 1000 V maximum. Machine model: equivalent to discharging a 200 pF capacitor through a 0.75 H coil and a 10 series resistor.
10. Thermal characteristics
Table 5. Symbol Rth(j-a) Thermal characteristics Parameter Conditions
[1]
Typ 100 91
Unit K/W K/W
thermal resistance from junction to ambient in free air DIP8 package SO14 package
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Product data sheet
Rev. 01 -- 15 September 2008
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
[1]
Thermal resistance Rth(j-a) can be lower when the GND pins are connected to sufficient copper area on the printed-circuit board. See the SSL152x application notes for details.
11. Characteristics
Table 6. Characteristics Measurement data valid at Tamb = 25 C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified. Symbol Supply ICC(oper) ICC(startup) ICC VCC(startup) VCC(stop) IDRAIN operating supply current start-up supply current supply current start-up supply voltage stop supply voltage current on pin DRAIN undervoltage lockout VDRAIN > 60 V no auxiliary supply with auxiliary supply Pulse width modulator min max SOPS Vdet(demag) tsup(xfmr_ring) RC oscillator VRC(min) VRC(max) tch fosc VREG Gv Vclamp(REG) (V/t)vrec fring td(vrec-swon) minimum voltage on pin RC maximum voltage on pin RC charging time oscillator frequency voltage on pin REG voltage gain clamp voltage on pin REG valley recognition voltage change with time ringing frequency valley recognition to switch-on delay time maximum voltage on pin SOURCE V/t = 0.1 V/s delay time short-winding protection voltage leading edge blanking time V/t = 0.5 V/s V/t = 0.5 V/s N x Vo = 100 V IREG = 6 mA 60 2.4 10 2.4 -102 200 75 2.5 1 100 2.5 20 550 150 90 2.6 200 2.6 7.5 +102 800 mV V s kHz V dB V V/s kHz ns demagnetization detection voltage transformer ringing suppression time 50 1.0 100 1.5 150 2.0 mV s minimum duty factor maximum duty cycle f = 100 kHz 0 75 % % 1.5 30 2 125 mA A normal operation start-up VDRAIN > 60 V -6 9 7.0 1.3 180 -4 9.5 7.5 1.9 400 -3 10 8.0 mA A mA V V Parameter Conditions Min Typ Max Unit
Duty factor regulator: pin REG
Valley switching
Current and short-circuit winding protection VSOURCE(max) td Vswp tleb
SSL152x_1
0.47 0.7 250
0.50 160 0.75 350
0.53 185 0.8 450
V ns V ns
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
Table 6. Characteristics ...continued Measurement data valid at Tamb = 25 C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified. Symbol IL(DRAIN) VBR(DRAIN) RDSon Parameter leakage current on pin DRAIN breakdown voltage on pin DRAIN drain-source on-state resistance Conditions VDRAIN = 650 V Tj > 0 C SSL1522; Isource = -0.25 A Tj = 25 C Tj = 100 C SSL15213; Isource = -0.50 A Tj = 25 C Tj = 100 C tf(DRAIN) fall time on pin DRAIN Vi = 300 V; no external capacitor at drain 6.5 9.0 75 7.5 10.0 ns 12 17 13.8 19.6 Min 650 Typ Max 125 Unit A V FET output stage
Temperature protection Tprot Tprot(hys) protection temperature hysteresis of protection temperature 150 160 2 170 C C
SSL152x_1
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Product data sheet
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SSL152x
SMPS ICs for low power systems
12. Application information
LF D5 Z1 CF1 CF2 D1 C5
mains
R1 R2 D2
CVCC
1 2
RRC R4 CRC R3
8 7 6
RAUX
C6 - Ycap
n.c.
RI
SSL152XP
3 4
5
014aaa562
Fig 6.
Typical configuration of SSL152x - primary sensing
SSL152x_1
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
13. Package outline
DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-13
Fig 7.
SSL152x_1
Package outline SOT97-1 (DIP8)
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 pin 1 index Lp 1 e bp 7 wM L detail X A1 (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 inches 0.069 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
0.028 0.004 0.012
8 o 0
o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 8.
SSL152x_1
Package outline SOT108-1 (SO14)
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Product data sheet
Rev. 01 -- 15 September 2008
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
14. Abbreviations
Table 7. Acronym BiCMOS DMOS ESR EZ-HV SOI FET SMPS SOPS Abbreviations Description Bipolar Complementary Metal Oxide Semiconductor Diffusion Metal Oxide Semiconductor Equivalent Series Resistance Easy High Voltage Silicon-On-Insulator Field-Effect Transistor Switched Mode Power Supply Self Oscillating Power Supply
15. Revision history
Table 8. Revision history Release date 20080915 Data sheet status Product data sheet Change notice Doc. number Supersedes Document ID SSL152x_1
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Product data sheet
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SSL152x
SMPS ICs for low power systems
16. Legal information
16.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
16.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
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Product data sheet
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NXP Semiconductors
SSL152x
SMPS ICs for low power systems
18. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.4 8.5 8.6 8.7 8.8 8.9 8.10 8.11 8.11.1 8.11.2 8.11.3 8.11.4 8.11.5 9 10 11 12 13 14 15 16 16.1 16.2 16.3 16.4 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Start-up and undervoltage lockout . . . . . . . . . . 5 Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Duty factor control. . . . . . . . . . . . . . . . . . . . . . . 5 Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 6 Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 7 Minimum and maximum duty factor . . . . . . . . . 7 OverCurrent Protection (OCP) . . . . . . . . . . . . . 7 Short circuit winding protection. . . . . . . . . . . . . 7 OverTemperature Protection (OTP) . . . . . . . . . 8 OverVoltage Protection (OVP) . . . . . . . . . . . . . 8 Characteristics of complete LED power supply 8 Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Ripple . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal characteristics. . . . . . . . . . . . . . . . . . . 9 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10 Application information. . . . . . . . . . . . . . . . . . 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Contact information. . . . . . . . . . . . . . . . . . . . . 16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2008.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 15 September 2008 Document identifier: SSL152x_1

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